Inside Electronics

National Instruments (NI) was started 50 years ago by Dr. Truchard—known to many as "Dr. T"—along with Jeff Kodosky and Bill Nowlin.". NI recently became part of Emerson. He was joined by Ritu Favre, President, Test and Measurement Business Group, and Kevin Schultz (CTO) at this year’s NI Connect 2026 in Fort Worth, TX. In this episode of Inside Electronics, we talk with Ritu Favre about NI in general and about LabVIEW’s Nigel AI. 

This episode of Inside Electronics, sponsored by DigiKey and RECOM Power, focuses on next-generation power solutions and the tradeoffs between modular and discrete power designs. The episode also covers key topologies, and how engineers can optimize for cost, size, efficiency, and time to market.
Host Alix Paultre introduces the topic and interviews Steve Roberts, Innovation Manager at RECOM Power. The conversation covers why power supply design is moving earlier in the product-development process, how modular solutions speed prototyping, and how discrete solutions can reduce cost and enable more customized, compact designs at higher volumes.
Alix and Steve also cover the main topologies—push-pull, full bridge, and flyback—and how RECOM Power supports engineers with preselected parts, evaluation boards, and combined driver/transformer solutions.

The emergence of "Physical AI" requires a bridge between digital logic and the chaotic variables of the analog world. TDK's SensorGPT serves as this bridge by creating a feedback loop: synthetic data trains the initial model, and the limited real-world data subsequently gathered is used to refine the generative parameters. 
Hear more about SensorGPT applications, capabilities and about its limitations and availability as Electronic Design Technology Editor Andy Turudic has a discussion with Abbas Ataya, Sr. Director of AI Systems & Software at TDK USA, in this edition of the Inside Electronics podcast. 

This episode of Inside Electronics, sponsored by DigiKey and Hammond Manufacturing, is a conversation about modified enclosures and how they can better meet design needs. Host Alex Paultre interviews Allyn Weilacher, Marketing Operations Specialist at Hammond. The discussion centers on why enclosures matter as the “body” of an electronic project, protecting components from weather, EMI/RFI, and harsh environments.
They also cover customization choices such as cutouts, labels, internal hardware, materials, IP ratings, and support for grounding or board mounting. A major theme is the practical workflow: Customers can use Hammond or DigiKey tools, upload dimensioned drawings, review pricing, approve a sample, and then place production orders starting at 25 units.
Alix and Allyn emphasize that the process is meant to be intuitive, transparent, and supported by direct engineering help when needed, with saved drawings making repeat orders or minor changes easy.

Consumer trust is a foundational element of any successful business, yet many companies don’t pay enough attention to tampering prevention in their products and systems. 
A single case of tampering can trigger recalls, lawsuits, and lost customers, and negative press spreads quickly. Once trust is broken, rebuilding it is very difficult and expensive. In this podcast, we talk to Chris Morrison, VP of Product Marketing at Agile Analog, about the issues around tempering in electronic systems.

As demand for memory in AI servers continues to grow, suppliers are shifting focus. This is creating new challenges for the automotive industry. Longer lead times, tighter supply, and shifting product strategies are forcing automakers and suppliers to rethink how they plan and design systems, raising the risk of component shortages and costly redesigns.
In this episode of Inside Electronics, host Alix Palture sits down with Jun Kawaguchi of Winbond who breaks down both the challenges and opportunities and how these market dynamics are impacting automotive memory as suppliers prioritize higher-value segments and reshape capacity across the semiconductor industry.
This conversation also explores new memory demand for higher density and performance as vehicles evolve from L2 to L2+ and higher segments from L3 to L3+, as well as the emergence of ADAS in 2-wheeled products like scooters.

The use of chiplets to create advanced systems-on-chip (SoCs) can deliver cost-effective solutions with better performance and lower power consumption, compared to monolithic chips. However, without proper standards and regulations, variations in chipsets could lead to incompatibility issues that can stifle development. Recently, Arm introduced the Chiplet System Architecture (CSA), providing a set of partitioning and connectivity standards for chiplets to align the industry. 
In this podcast we talk to Eddie Ramirez, VP of Infrastructure Business at Arm, about the chiplet ecosystem and the things the company is doing in the space. 

We sat down with Daan Kuitenbrouwer, Co-Founder at Delft Circuits, to talk about the company’s effort in that direction. Delft’s Cri/oFlex superconducting cables replace conventional wiring inside cryostats, delivering higher channel density, lower thermal load, and proven reliability at scale in quantum and cryogenic systems. 

Sometimes it seems that we are on the verge of adequately commercializing autonomous driving, and then it seems like it'll never happen. We talk about the application space and the technology required with Dr. Stefan Poledna, co-founder, CTO, and CEO of TTTech Auto.

AI and data center growth are putting unprecedented pressure on memory infrastructure, and the industry is feeling the effects. In this episode of Inside Electronics, host Alix Palture speaks with Brian Watson, Marketing Manager for Customized Memory Solutions at Winbond, about the challenges created by the rapid shift toward HBM and DDR5, the ongoing shortage of DDR4, and why legacy memory technologies remain essential for many real-world designs.
Brian shares how Winbond helps customers bridge supply gaps, support long product lifecycles, and deliver performance through solutions like Cube architecture for applications that need bandwidth without the HBM price point. If you want a clear look at the memory pressures shaping AI, data centers, and the broader engineering landscape, this episode is for you.