Inside Electronics

Engineering the Fit: Modified Enclosures That Meet Your Design Needs

This episode of Inside Electronics, sponsored by DigiKey and Hammond Manufacturing, is a conversation about modified enclosures and how they can better meet design needs. Host Alex Paultre interviews Allyn Weilacher, Marketing Operations Specialist at Hammond. The discussion centers on why enclosures matter as the “body” of an electronic project, protecting components from weather, EMI/RFI, and harsh environments.
They also cover customization choices such as cutouts, labels, internal hardware, materials, IP ratings, and support for grounding or board mounting. A major theme is the practical workflow: Customers can use Hammond or DigiKey tools, upload dimensioned drawings, review pricing, approve a sample, and then place production orders starting at 25 units.
Alix and Allyn emphasize that the process is meant to be intuitive, transparent, and supported by direct engineering help when needed, with saved drawings making repeat orders or minor changes easy.

Tamper Detection and Prevention in Electronic Systems

Consumer trust is a foundational element of any successful business, yet many companies don’t pay enough attention to tampering prevention in their products and systems. 
A single case of tampering can trigger recalls, lawsuits, and lost customers, and negative press spreads quickly. Once trust is broken, rebuilding it is very difficult and expensive. In this podcast, we talk to Chris Morrison, VP of Product Marketing at Agile Analog, about the issues around tempering in electronic systems.

What’s Next for Automotive Memory? Why AI Demand Is Changing the Industry

As demand for memory in AI servers continues to grow, suppliers are shifting focus. This is creating new challenges for the automotive industry. Longer lead times, tighter supply, and shifting product strategies are forcing automakers and suppliers to rethink how they plan and design systems, raising the risk of component shortages and costly redesigns.
In this episode of Inside Electronics, host Alix Palture sits down with Jun Kawaguchi of Winbond who breaks down both the challenges and opportunities and how these market dynamics are impacting automotive memory as suppliers prioritize higher-value segments and reshape capacity across the semiconductor industry.
This conversation also explores new memory demand for higher density and performance as vehicles evolve from L2 to L2+ and higher segments from L3 to L3+, as well as the emergence of ADAS in 2-wheeled products like scooters.

Advancing the Chiplet Ecosystem

The use of chiplets to create advanced systems-on-chip (SoCs) can deliver cost-effective solutions with better performance and lower power consumption, compared to monolithic chips. However, without proper standards and regulations, variations in chipsets could lead to incompatibility issues that can stifle development. Recently, Arm introduced the Chiplet System Architecture (CSA), providing a set of partitioning and connectivity standards for chiplets to align the industry. 
In this podcast we talk to Eddie Ramirez, VP of Infrastructure Business at Arm, about the chiplet ecosystem and the things the company is doing in the space. 

Enabling Next-Generation Quantum Computing Infrastructures

We sat down with Daan Kuitenbrouwer, Co-Founder at Delft Circuits, to talk about the company’s effort in that direction. Delft’s Cri/oFlex superconducting cables replace conventional wiring inside cryostats, delivering higher channel density, lower thermal load, and proven reliability at scale in quantum and cryogenic systems. 

Empowering Advanced Autonomous Driving Systems

Sometimes it seems that we are on the verge of adequately commercializing autonomous driving, and then it seems like it'll never happen. We talk about the application space and the technology required with Dr. Stefan Poledna, co-founder, CTO, and CEO of TTTech Auto.

How AI Is Reshaping Memory in the Data Center

AI and data center growth are putting unprecedented pressure on memory infrastructure, and the industry is feeling the effects. In this episode of Inside Electronics, host Alix Palture speaks with Brian Watson, Marketing Manager for Customized Memory Solutions at Winbond, about the challenges created by the rapid shift toward HBM and DDR5, the ongoing shortage of DDR4, and why legacy memory technologies remain essential for many real-world designs.
Brian shares how Winbond helps customers bridge supply gaps, support long product lifecycles, and deliver performance through solutions like Cube architecture for applications that need bandwidth without the HBM price point. If you want a clear look at the memory pressures shaping AI, data centers, and the broader engineering landscape, this episode is for you.

The Evolving Role of Silicon in Power Electronics

With the advance of wide-bandgap power semiconductors in the marketplace, many are starting to feel that the time is getting short for silicon-based power electronics. However, the fundamental structure of the silicon power MOSFET remained largely unchanged, and there is still a window of opportunity to develop next-generation devices that can leverage the maturity and expertise of the silicon processing industry. 
One such company, iDEAL Semiconductor, has redefined the legacy structure with its SuperQ advanced REduced SURface Field (RESURF) Silicon Power MOSFET architecture. 

Why All These Flash Drive Form Factors?

Enterprise and Data Center SSD Form Factors (EDSFF) include E1 and E3 that have supplanted the conventional M.2 and 2.5-in form factors like U.2 in high end servers. M.2 slots are often found on motherboards but server removable drives are now dominated by EDSFF that support the latest PCI Express-based NVMe interfaces that provide massive throughput. In this episode, Sebastien Jean, Chief Technology Officer at Phison Electronics, about the history and evolution of drive form factors and how flash memory has changed the form factor design. 

Addressing Advanced Connectivity in Extreme Environments

For more than six decades, Cinch Connectivity Solutions has addressed the demanding requirements of applications such as space exploration, delivering reliable, cost-effective solutions by leveraging its global team of expert engineers, manufacturing, and sales support. Cinch Connectivity Solutions’ CIN::APSE provides high-reliability, high-performance solderless, high-density interconnects for board-to-board, flex-to-board, and component-to-board applications.