Inside Electronics

Nano Nuclear’s 5MWt Electricity Generator Fits in a Shipping Container

Insane levels of electrical power are needed to support AI in datacenters, and the electrification of mobility means development of remote locations for the extraction of critical mineral resources including the powering of fully electric 1MW mining trucks. A number of startups are developing Small Modular Reactors in the 20MW to 500MW power output range, requiring extensive site development, construction and support resources, but Nano Nuclear Energy Inc. is uniquely positioned in the microreactor space with two commercial microreactor designs that output up to 5MWt with the complete electrical generator housed in an ISO shipping container. 

Addressing the Challenges in Medical Device Development

Devices are becoming more intelligent and can be tailored to be patient-specific, making a medical device that not only provides for the whole population, but can also really target the patient cohort or the target group of the disease or condition that must be treated or diagnosed.
There are many recent advances that have enabled medical advice development, from the sensors to the software, and in this episode, we talk to Dr. Visa Suomi from MathWorks about the complexity and inter-functionality of advanced medical devices.

Learn About Designing Power Management Systems with Frederik Dostal

All electrical systems need power and these days most systems need a steady, efficient, and cost-effective source. Solutions like switched mode power supplies (SMPS) are now common but not necessarily easy to design or select.  
Guest host Bill Wong talks with Frederik Dostal, a power supply expert with Analog Devices and also the author of the regular Dostal’s Design video/article series covering power supply design tips.  

Find Out About Network-on-Chip Technology

Today’s system-on-chips (SoC) are very complex. They have multiple cores and often many different types of cores including CPUs, GPUs, and NPUs. Connecting these to peripherals and memory as well typically include one or more network-on-chips (NoC). 
In this podcast, guest host Bill Wong talks with Andy Nightingale, VP Product Management and Marketing at Arteris, about NoCs. 

Practical Spiking Neural Networks

In this episode of Inside Electronics, Senior Content Director Bill Wong talks with Steve Brightfield, CMO at BrainChip, about neuromorphic computing in the form of spiking neural networks (SNN). SNNs take an event-based approach to artificial intelligence and machine learning (AI/ML).
Brainchip's Akido technology implements SNNs in hardware providing similar acceleration support that existing neural processing units (NPU) provide but with significantly better performance and lower power requirements.

Putting Time Sensitive Networking (TSN) into Products

Industrial automation is getting real (time) with time sensitive networking (TSN). This open standard delivers determinism to Ethernet control networks and it works with wireless networks as well.
Senior Content Director Bill Wong talks with Tom Burke, Global Strategic Advisor, CC-Link Partner Association (CPLA) about how TSN works and why it is so important to industrial automation applications. 

Making Sense of the Maker Movement

The Maker Movement is a relatively new phenomenon in society...or is it? The desire to understand technology and create things is a drive that has existed in people since the first devices were created. We sit down with Electronic Design editors Andy Turudic and Cabe Atwell for a discussion about the Maker Movement, Tinkerers, and engineering. 

Analog ASIC Course Tapes Out Real Silicon to TI's Advanced 300mm Fa

In this episode, Andy Turudic talks with Georgia Tech’s Professor Shaolan Li about their ECE department’s new analog IC design course where close to a dozen teams of three undergrad and one graduate student are fully hands-on designing real silicon, from schematic through tapeout, with resumption of the course to perform functional verification in a returning semester, after fabrication on a 300mm wafer by Texas Instruments. 

Addressing the Challenges in Advanced Logic Semiconductor Manufacturing

Making logic chips has never been an easy task, and it is one that has been further challenged by advances in scaling as well as advanced topologies like chiplets. From the race to 2nm-foundry creation for next-generation wafer development and the related issues of packaging, engineers must develop new solutions. In this episode, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing. 

Optical Chiplet Interconnect Promises to Accelerate Demanding Computing Applications

The growth in high-performance computing and AI in advanced chip architectures is creating issues when it comes to intra-chip data management, especially as they migrate to chiplet-based topologies. Addressing this chip-level issue, Avicena  announced its scalable LightBundle chiplet interconnect solution, offering ultra-high density die-to-die connections with a multi-Tbps/mm shoreline bandwidth density at sub-pJ/bit energy efficiency. In this podcast we talk to Bardia Pezeshki, Founder and CEO of Avicena, about the issues of intra-chip data management and his company’s solution.