Inside Electronics

Learn About Designing Power Management Systems with Frederik Dostal

All electrical systems need power and these days most systems need a steady, efficient, and cost-effective source. Solutions like switched mode power supplies (SMPS) are now common but not necessarily easy to design or select.  
Guest host Bill Wong talks with Frederik Dostal, a power supply expert with Analog Devices and also the author of the regular Dostal’s Design video/article series covering power supply design tips.  

Find Out About Network-on-Chip Technology

Today’s system-on-chips (SoC) are very complex. They have multiple cores and often many different types of cores including CPUs, GPUs, and NPUs. Connecting these to peripherals and memory as well typically include one or more network-on-chips (NoC). 
In this podcast, guest host Bill Wong talks with Andy Nightingale, VP Product Management and Marketing at Arteris, about NoCs. 

Practical Spiking Neural Networks

In this episode of Inside Electronics, Senior Content Director Bill Wong talks with Steve Brightfield, CMO at BrainChip, about neuromorphic computing in the form of spiking neural networks (SNN). SNNs take an event-based approach to artificial intelligence and machine learning (AI/ML).
Brainchip's Akido technology implements SNNs in hardware providing similar acceleration support that existing neural processing units (NPU) provide but with significantly better performance and lower power requirements.

Putting Time Sensitive Networking (TSN) into Products

Industrial automation is getting real (time) with time sensitive networking (TSN). This open standard delivers determinism to Ethernet control networks and it works with wireless networks as well.
Senior Content Director Bill Wong talks with Tom Burke, Global Strategic Advisor, CC-Link Partner Association (CPLA) about how TSN works and why it is so important to industrial automation applications. 

Making Sense of the Maker Movement

The Maker Movement is a relatively new phenomenon in society...or is it? The desire to understand technology and create things is a drive that has existed in people since the first devices were created. We sit down with Electronic Design editors Andy Turudic and Cabe Atwell for a discussion about the Maker Movement, Tinkerers, and engineering. 

Analog ASIC Course Tapes Out Real Silicon to TI's Advanced 300mm Fa

In this episode, Andy Turudic talks with Georgia Tech’s Professor Shaolan Li about their ECE department’s new analog IC design course where close to a dozen teams of three undergrad and one graduate student are fully hands-on designing real silicon, from schematic through tapeout, with resumption of the course to perform functional verification in a returning semester, after fabrication on a 300mm wafer by Texas Instruments. 

Addressing the Challenges in Advanced Logic Semiconductor Manufacturing

Making logic chips has never been an easy task, and it is one that has been further challenged by advances in scaling as well as advanced topologies like chiplets. From the race to 2nm-foundry creation for next-generation wafer development and the related issues of packaging, engineers must develop new solutions. In this episode, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing. 

Optical Chiplet Interconnect Promises to Accelerate Demanding Computing Applications

The growth in high-performance computing and AI in advanced chip architectures is creating issues when it comes to intra-chip data management, especially as they migrate to chiplet-based topologies. Addressing this chip-level issue, Avicena  announced its scalable LightBundle chiplet interconnect solution, offering ultra-high density die-to-die connections with a multi-Tbps/mm shoreline bandwidth density at sub-pJ/bit energy efficiency. In this podcast we talk to Bardia Pezeshki, Founder and CEO of Avicena, about the issues of intra-chip data management and his company’s solution.

Developing Advanced Infrastructures for Data Center and AI SoC Applications

The increasing demand for high-performance computing for next-generation AI and advanced data centers is putting pressure on designers to field the latest data-management solutions. Addressing this demand, Rambus recently unveiled an updated PCI Express 7.0 IP portfolio, encompassing a comprehensive suite of IP solutions, as well as a controller IP for GDDR7 to allow for greater speeds and bandwidths to support generative AI workloads.
These applications consume memory at an unprecedented pace, and the new controller IP will unlock more memory for AI and high-performance computing applications, particularly in inferencing and at the network’s edge. In this podcast we talk with Lou Ternullo, Senior Director of IP Solutions at Rambus, about how the GenAI boom is pushing new advancements in innovations in the memory space.

Wi-Fi HaLow Offers Advanced Low-Power Connectivity to IoT Products

Addressing the need for low-power high-reliability connectivity in IoT solutions, Wi-Fi HaLow promises extended ranges, improved penetration capabilities, extended battery life, enhanced device density, higher level of security, and elevated data throughput in IoT scenarios. The Wireless Broadband Alliance (WBA)  recently announced the Wi-Fi HaLow for IoT program has moved into a new phase, testing 802.11ah Wi-Fi HaLow solutions in real-world use cases, including a range of applications including smart home, smart city, building automation, smart retail, industrial IoT, and agriculture technology.
Tiago Rodrigues, CEO of the Wireless Broadband Alliance, talks about the trails and the overall IoT marketplace.